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Wafer Cutting Machine


Wafer cutting machine is a system designed for cutting wafer blocks with cream spread on by steel knives or cutting wires.

Product Information

  • There is transparent mica on lids in order to provide safety
  • Initially, wafer blocks pass through the first cutting cage, and then moved to the second cutting cage
  • Easily-changed cutting mold
  • There are channels for cut wastes on sides of wafer blocks
  • Single or multi stowage
  • Cutting with blades or wires
  • Precise cutting of the wafer blocks
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